Press coverage about ASE Group (NYSE:ASX) has trended somewhat positive on Monday, Accern Sentiment Analysis reports. The research group scores the sentiment of press coverage by monitoring more than 20 million news and blog sources in real-time. Accern ranks coverage of public companies on a scale of negative one to one, with scores nearest to one being the most favorable. ASE Group earned a news impact score of 0.11 on Accern’s scale. Accern also gave headlines about the semiconductor company an impact score of 46.490407070102 out of 100, indicating that recent press coverage is somewhat unlikely to have an effect on the company’s share price in the near future.
ASX traded up $0.19 during trading on Monday, hitting $7.63. 973,726 shares of the company traded hands, compared to its average volume of 901,578. The stock has a market capitalization of $12,311.04, a price-to-earnings ratio of 17.74, a PEG ratio of 2.01 and a beta of 0.73. ASE Group has a 1 year low of $5.86 and a 1 year high of $7.68. The company has a debt-to-equity ratio of 0.22, a quick ratio of 1.11 and a current ratio of 1.34.
ASE Group (NYSE:ASX) last posted its earnings results on Thursday, February 1st. The semiconductor company reported $0.12 earnings per share for the quarter. The company had revenue of $2.73 billion during the quarter. ASE Group had a net margin of 7.95% and a return on equity of 12.10%. equities research analysts forecast that ASE Group will post 0.47 earnings per share for the current year.
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About ASE Group
Advanced Semiconductor Engineering, Inc provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions.
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